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德国汉高乐泰银胶

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德国汉高乐泰银胶 84-1lmisr4是一种单组份、低粘度的导电银胶。胶流变性能好，适用于高速die attach封装，无拉丝和拖尾；纯度高，广泛应用在半导体工业主要用于半导体芯片的粘贴，适用于全自动机器高速点胶，是目前世界上出胶速度最快的一款导电银胶。
特点: 流变性能好，适用于高速die attach封装，无拉丝和拖尾；纯度高，广泛应用在半导体工业。
成份：含银环氧树脂
外观：银浆
密度 3.5g/cm3
粘度 25℃ 80pa.s
工作寿命25℃ 18hrs
完全固化时间 175℃*60min
芯片剥离测试 19kg
cte 40ppm/℃
导热率 2.5w/m.k
体积电阻 25℃ 0.0001ohm-cm
储存期 -10c*6months
主要应用: led、ic、lcd、pcba、点阵块、陶瓷电容、薄膜开关、智能卡、射频识别等电子元件和组件的封装和粘接。

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